Samsung has announced plans to integrate cutting-edge technology by 2030, aimed at enhancing the efficiency of its DRAM production while extending its scaling roadmap. As one of the leading memory chip manufacturers globally, Samsung confirmed it would utilize ASML’s high-precision machinery starting in 2028 for DRAM fabrication, a crucial category of computer memory.
ASML’s extreme ultraviolet (EUV) lithography systems are essential in the semiconductor manufacturing process, specifically for defining intricate circuitry on silicon wafers. The latest High NA machines from ASML are capable of printing more detailed patterns, with their price tag hovering around $400 million.
Both Samsung and TSMC, two of the world's foremost chip producers, have pledged to leverage ASML's High NA extreme ultraviolet lithography technology to meet the surging demand for advanced semiconductor solutions. TSMC highlighted that the incorporation of ASML's equipment will be essential for the development of sophisticated chips, particularly as the complexity of transistor architectures increases for AI-related applications.
Investors are keenly observing the role of High NA EUV machines in propelling ASML's growth, especially after a remarkable 120% stock increase over the past year. Barclays commented that the recent announcements provide clearer insights into the adoption of this technology, considering it a positive development.
In early trading on Tuesday, ASML's shares showed minimal fluctuations. Alongside TSMC and Samsung, Intel has also become a client of ASML’s High NA systems, having announced its engagement with this advanced EUV technology for chip manufacturing back in July.
While ASML has not recently projected specific sales figures for its High NA machines, the company did state a plan to boost its EUV capacity by approximately 30% by 2027. Analysts at Barclays noted that the latest updates contribute to ASML's strategic planning, underscoring the strong demand for these innovations.
Additionally, TSMC and Samsung are set to collaborate with ASML on advancing the next generation of 12-inch photomask technology—stepping up from the current 6-inch format. Photomasks play a critical role in chip production as they serve as the templates for transferring patterns onto wafers. ASML emphasized that larger photomasks would lead to increased productivity and reduced manufacturing costs in chip production.



